Business

Published: 10 Jun 2009 03:11:55 PST

Germany’s Bosch Packaging Technology targets a reduction in material costs and ‘cold’ packaging for delicate confectionery goods with its ultrasonic sealing technology.

The vertical form fill and seal machine SVE2515WR uses a method for joining thermoplastic materials together by emitting acoustic vibrations that create a ‘tight, strong seam for closures’.

Targeted at doy-style stand up pouches, as well as gusseted and pillow bag packaging formats, Bosch claims its ultrasonic technology is an alternative to heat sealing, and can process conventional heat sealed packages, such as those composed of polypropylene and polyethylene film. In terms of cost savings, the firm suggests that by removing the heating element in their sealing process, manufacturers can potentially reduce the thickness of the sealant layer of packaging film structures, thereby cutting costs for materials. With the ultrasonic process, the packaging film is sealed with heat from friction generated by an oscillating tool, ‘eliminating the need’ for direct heat contact.

Published: 06 May 2009 02:37:31 PST

In an effort to develop new semiconductor packaging technologies, DuPont Wafer Level Packaging Solutions, part of DuPont Electronic Technologies, has signed a joint-development agreement with Nippon Kayaku Co Ltd (NKC) and its wholly owned subsidiary, MicroChem Corp.

The electronic materials developed under the agreement will be new advanced photodefinable epoxy-based materials. They will be directed at wafer level packaging, 3D and through-silicon via (TSV) semiconductor packaging applications that are transforming electronics to make them smaller, lighter weight, more functional and more cost-effective.

“Combining the expertise of Nippon Kayaku and MicroChem in advanced epoxy resins and formulation, with DuPont coating technology, material science and electronic applications knowledge means that we can generate a series of enabling materials faster,” said Mats Ehlin, global business manager, DuPont Wafer Level Packaging Solutions.

DuPont estimates the materials market for wafer level packaging, 3D and TSV will grow from about $ 100 million in 2009, to more than $ 600 million in 2013, and could as much as double to $ 1.2 billion by 2015. Wafer level packaging is spreading rapidly as a way to significantly improve the efficiency and reduce the size of semiconductor packages.

Published: 20 Apr 2009 01:15:36 PST

Bosch Packaging Technology, a leading supplier of holistic systems in the world of packaging and process technology, is changing the company names of some of its subsidiaries, effective April 2nd 2009. The US-based Doboy Inc., New Richmond, will change to Bosch Packaging Technology, Inc. The Dutch Tevopharm B.V., Schiedam, will become Bosch Packaging Technology B.V. The Swiss Demaurex SA, Lausanne, will be called Bosch Packaging Technology SA. The Dutch Robert Bosch Verpakkingsmachines B.V., Weert, will change its company name to Robert Bosch Packaging Technology B.V.

“The standardization of company names underscores the complete integration of our companies under the umbrella of Bosch Packaging Technology, emphasizing our one-stop shopping strategy across all Business Units”, explains Friedbert Klefenz, President of Bosch Packaging Technology. “This standardization allows us to leverage the excellent global reputation of the Bosch brand to strengthen our market presence.”

Copyright ©Ringier Trade .com.

Published: 16 Apr 2009 19:06:36 PST

Keen interest was registered in Upakovka/Upak Italia 2009, the international trade fair on machinery and equipment for the manufacture of packaging, packaging machinery, confectionery machinery, packaging and packaging aids and logistics. Jointly staged between January 27 and 30, Interplastica 2009, the International Trade Fair Plastics and Rubber, and the premier trade fair for the packaging industry in Russia together welcomed 20,500 trade visitors from all corners of the CIS and its neighbours. A total of about 900 exhibitors rented a net area of 19,000 sq m to showcase their offerings.

Werner M Dornscheidt, president and CEO, Messe Düsseldorf, summed up the event in positive tones saying, “Economic conditions worldwide and in the region currently present Russian businesses with serious challenges. The fact that we have received such a warm response from both exhibitors and visitors in such trying times bears testimony to the role of Upakovka/Upak Italia as a leading platform for innovation and providing an economic spur to the industry.”

Published: 16 Apr 2009 19:01:19 PST

Altea Packaging, a Tunisia-based flexible packaging manufacturer, has acquired the Egypt-based Porta Egypt and its subsidiary Rotopack Misr. Porta Egypt, established in 1995, specialises in rotogravure printed flexible packaging. It has an annual capacity of more than 10,000 tonne and a turnover of more than $ 35 million. In a statement, the company said, “There are clear synergies and know-how

Published: 16 Apr 2009 18:46:50 PST

Alcan Packaging has sold its food flexible packaging plant in Arras, Northern France to Plastienvase Francia Sarl, a 100-per cent subsidiary of Plastienvase SA based in the Cordoba region of southern Spain. “We are confident that the Arras business will benefit from new opportunities and realise its full growth potential with Plastienvase, a well-established participant in the European food packaging industry,” said Michael Cronin, president, Alcan Packaging Food Europe.

Plastienvase was founded in 1985 and operates two facilities in the Cordoba region, employing 247 people with sales of Euro 37 million in 2007. The Arras plant, which employs 182 people, will operate under the Plastienvase Francia name.

Alcan Packaging Food Europe, a business of Alcan Packaging, is the European leader in flexible packaging for the food and beverages market with registered sales of $ 2.3 billion in 2007. It operates 31 plants in 18 countries and employs 7,300 people.

Published: 16 Apr 2009 02:26:08 PST

Ipack-ima 2009, an exhibition on processing, packaging and material handling, to be held from March 24-28, 2009 in Milan, will feature a thematic area titled ‘Feed and pet food’. A total of 85 exhibiting companies will display cutting-edge technological solutions, both in terms of machinery and materials, for pet food industry professionals and marketing managers from distribution chains – private brand products account for more than 20 per cent of the market. Different kinds of pet food employ aluminium

Published: 15 Apr 2009 19:32:39 PST

The increased use of flexible packaging like pouches is increasing the use of corrugated cases rather than trays in the supply chain, according to Daniele Bellante, managing director, Cama Group. While bottles and tins can be shipped in corrugated trays, flexible pouches require more substantial protection, said Bellante. However, the PMMI’s secondary packaging market research study predicted a move away from corrugated secondary packaging towards shrink-wrapping.

Bellante added that many in the industry were looking at ways to reduce the practice of placing items into both a retail-ready case and then a transit shipper. One option is to strengthen the retail-ready case, so that an additional shipper is not required. Cama Group, which is based in North of Milan, makes a range of secondary packaging machines, including cartoning, sleeving, case packing and case erecting machines.

Published: 14 Apr 2009 20:25:41 PST

Bosch Packaging Technology, a leading supplier of holistic systems in the world of packaging and process technology, is changing the company names of some of its subsidiaries, effective April 2nd 2009. The US-based Doboy Inc., New Richmond, will change to Bosch Packaging Technology, Inc. The Dutch Tevopharm B.V., Schiedam, will become Bosch Packaging Technology B.V. The Swiss Demaurex SA, Lausanne, will be called Bosch Packaging Technology SA. The Dutch Robert Bosch Verpakkingsmachines B.V., Weert, will change its company name to Robert Bosch Packaging Technology B.V.

“The standardization of company names underscores the complete integration of our companies under the umbrella of Bosch Packaging Technology, emphasizing our one-stop shopping strategy across all Business Units”, explains Friedbert Klefenz, President of Bosch Packaging Technology. “This standardization allows us to leverage the excellent global reputation of the Bosch brand to strengthen our market presence.”

Copyright ©Ringier Trade .com.

Published: 11 Apr 2009 14:02:48 PST

The government has declared two stimulus packages in the last few weeks to boost exports and to tackle the global economic crisis, but a sense of euphoria seems to be missing in the exporter’s community. The apparel export industry in particular does not seem to be so happy with the announcements. All the apex apparel associations aver that, apparel exports will fall short of a wide margin of the targeted US $11.6 billion in the current fiscal year (2008-09).

Reacting to the announcement of the second stimulus package, the Chairman, Mr Rakesh Vaid, of the Apparel Export Promotion Council (AEPC), which has more than 6,000 member companies on its rolls said, “The government has done very little to help the $10 billion apparel export sector which employs nearly 3.9 million workers. Lakhs of workers have lost work due to global economic recession.”

“We are in consultation with officials and hope the government will come up with concrete measures soon to revive the textile and readymade garments industry,” he added by saying. Against the set target of $11.6 billion, the apex body of apparel exporters does not expect to cross $8.78 billion in the current fiscal year, compared to $9.69 billion achieved in the previous fiscal year (2007-08).

In response to the first package declared in December, Mr Vaid had said, “We were expecting an increase in duty drawback rates, but there is no mention of it in the package. We have also been demanding income tax exemption for five years to offset the huge losses piling up, but there has been no response.”

Mr Vaid said that the allocation of Rs 1,400 Crore for textile up-gradation fund is what the government owes to the industry. “The allocation which has been pending for many years is for payment of arrears. There is nothing new in it”, he added by saying. On two per cent interest subvention for exporters up to March 2009, Mr Vaid said the move will benefit the sector marginally”

The President of the Clothing Manufacturers Association of India (CMAI), Mr Rahul Mehta gravely said, “The $35 billion Indian apparel industry remains in severe crisis zone as there is nothing to stimulate production in the domestic segment and inadequate incentives in the export sector. The reforms package announced by the government offers no incentives for revival of the apparel industry facing mounting costs, shrinking local and global markets thereby compelling cut in production and employment.”

He vehemently said, “In contrast, China has increased its export incentives three times in the last six months, raising them from 11 to 17 percent and Pakistan too has announced a R